Features

- Strong adhesion to wafer with hydrophobic property to prevent water seepage for stable consistent back grinding process.

- Excellent withstanding a change with the passage time and edge crack through using acrylic adhesive

- Extremely minimal contamination and ensuring precision wafer thickness

- Completed Back grinding tape for DBG process controlled as ±1.5um T.T.V.

Application

Protection of semiconductor circuits during the process of wafer backside grinding